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Wangling F4BME217 DK2.17 PIM ≤-159dBc (0.1-12.0mm) Copper Clad Laminate
Brief Introduction
F4BME217 is a PTFE-based, fiberglass-reinforced high-frequency laminate designed for RF and microwave printed circuit board applications requiring low Passive Intermodulation (PIM) performance. It uses reverse-treated RTF copper foil to deliver excellent signal integrity, precise circuit control, and reduced conductor loss, making it suitable for sensitive RF systems.
Technical Features & Benefits
Low and Stable Dielectric Constant: Dk = 2.17 ±0.04 at 10 GHz, ensuring consistent signal performance.
Low Loss Characteristics: Dissipation factor as low as 0.001 at 10 GHz, supporting high-frequency, low-loss designs.
Excellent PIM Performance: PIM value ≤ –159 dBc, ideal for demanding RF and cellular applications.
Good Thermal and Dimensional Stability: Low CTE and high thermal conductivity support reliable operation under thermal cycling.
High Insulation Resistance: Volume resistivity ≥6×10⁶ MΩ·cm, ensuring electrical reliability.
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Typical Properties: F4BME 217
| Property |
Test Condition |
Unit |
F4BME217 |
| Dielectric Constant (Typ.) | 10 GHz | – | 2.17 |
| Dk Tolerance | – | – | ±0.04 |
| Loss Tangent (Typ.) | 10 GHz | – | 0.001 |
| 20 GHz | – | 0.0014 |
| TC of Dk | –55°C to 150°C | ppm/°C | –150 |
| Peel Strength (1 oz) | RTF Copper | N/mm | >1.6 |
| Volume Resistivity | Ambient | MΩ·cm | ≥6×10⁶ |
| Surface Resistivity | Ambient | MΩ | ≥1×10⁶ |
| Dielectric Strength (Z) | 5 kV, 500 V/s | kV/mm | >23 |
| Breakdown Voltage (XY) | 5 kV, 500 V/s | kV | >30 |
| CTE (XY) | –55°C to 288°C | ppm/°C | 25–34 |
| CTE (Z) | –55°C to 288°C | ppm/°C | 240 |
| Water Absorption | 20±2°C, 24 h | % | ≤0.08 |
| Density | Ambient | g/cm³ | 2.17 |
| Thermal Conductivity (Z) | Z-direction | W/(m·K) | 0.24 |
| PIM Value | – | dBc | ≤–159 |
| Flammability | – | UL 94 | V-0 |
| Composition | – | – | PTFE, Fiberglass Cloth, Reverse-Treated RTF Copper Foil |
Application Areas
RF and Microwave Circuits: Base station antennas, RF front-end modules.
Low-PIM Systems: Cellular infrastructure, distributed antenna systems (DAS).
Satellite Communications: Phased array antennas, feed networks.
Aerospace and Defense: Radar systems, electronic warfare platforms.
High-Frequency Test Equipment: Probes, fixtures, and calibration substrates.
Available Configurations
Copper Foil: Reverse-treated RTF copper, 0.5 oz and 1 oz options.
Panel Sizes: 460×610 mm, 500×600 mm, 850×1200 mm, 914×1220 mm, 1000×1200 mm.
Thickness Range: 0.1 mm to 12.0 mm (minimum 0.1 mm for Dk ≤ 2.65).
Metal-Clad Options: Aluminum or copper-backed versions available (F4BME217–AL/CU).
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